ABOUT PRODUCT

Description

High strength
High heat resistance
High-quality interlayer adhesion

PC K7 is a specialized PC consumable applicable to desktop FDM/FFF. With targeted improvements, it makes enhancement in warping and inadequate interlayer bonding when PC materials apply to desktop printers. Thus, it is applicable to printed products or structural parts which are with high strength or require a certain heat resistance temperature.

Technical Specifications

• Material Type

          FDM PC

• Recommended Extrusion Temperature

          250°C-270°C

• Build Platform Temperature

          80°C-100°C

• Tolerance

          ± 0.03 mm 

• Net Weight

          0.5KG/ 1KG/ 3KG per Spool